Block I logo
University of Illinois Urbana-Champaign
  • My.MNTL
The Grainger College of Engineering
Holonyak Micro & Nanotechnology Lab
Search
  • About

    About

    • Who was Nick Holonyak Jr.?
    • History
    • Administrative Offices and Services
    • Inventory
    • Job Opportunities
    • Purchasing
    • Travel
  • News

    News

    • Holonyak Headlines (monthly)
    • 2030 Strategic Vision
  • Research

    Research

    • Research Themes
      • High Speed Electronic Systems for 5G/6G
      • Photonic Technologies
      • Quantum Technologies
      • Nanoscale Devices for Artificial Intelligence
      • Wide-and Ultrawide-bandgap Power Electronics
      • Translational Biotechnologies
      • Neurotechnologies
    • Faculty Research Groups
    • Research Centers
    • Technology Commercialization
  • Facilities

    Facilities

    • Become a User
      • BioNanotechnology Lab Access
      • Building Access
      • Cleanroom Access
    • Cleanroom Labs
    • Device Characterization Labs
    • BioNanotechnology Laboratory
    • Rates
    • Materials Safety Data Sheets (MSDS)
    • Chemical Storage
    • Atrium + Seminar Room Reservation
  • Alumni

    Alumni

    • Alumni Profiles
  • Directory

    Directory

    • Faculty and Postdocs
      • Resident Faculty
      • Faculty Affiliates
      • Postdocs
    • Graduate Students
    • Staff
  • Events

    Events

    • HMNTL Seminar Series
    • Upcoming Events
    • Fall 2025 Holonyak Workshop
    • Holonyak Workshop 2024
    • HMNTL Graduate Student Colloquium
    • Stillman Lecture Series
    • Webinars
  • Education and Outreach

    Education and Outreach

    • Samsung Semiconductor Technology Program
    • Outreach
  • My.MNTL
  • Home
  • Facilities
  • Device Characterization Labs
  • Kulicke & Soffa 4524AD Ball Bonder
In This Section
  • Facilities Overview
  • Become a User
    • BioNanotechnology Lab Access
    • Building Access
    • Cleanroom Access
  • Cleanroom Labs
  • Device Characterization Labs
  • BioNanotechnology Laboratory
  • Rates
  • Materials Safety Data Sheets (MSDS)
  • Chemical Storage
  • Atrium + Seminar Room Reservation

Kulicke & Soffa 4524AD Ball Bonder

[page_title]

The Model 4524AD Multi-Process Auto Stepback Ball Bonder for gold wire is ideal for Research & Development and small production lots where unique processes are used. Single point TAB, ball bumping, and coining, together with standard ball bonding, offer process flexibility and versatile capabilities. Semi-auto manual and automatic operation modes, individual bond parameter control and a wide range of wire diameters make it ideal for a variety of applications. The new digital option enables programming of unique bonding schedules. Up to 200 different bonding programs may be stored in the memory. The built-in programmable Negative Electronic Flame-Off (N.E.F.O.) system provides consistency and fine control of ball size. Our system is using 1.3mil(33.02um) gold wire and typical bonding temperature is set at 130C, but the stage temperature controller can go up to 250C.

Request Training (need to provide your own cap, you should purchase UTS-38JH-AZM-1/16-16MM from Small Precision Tools)
For more information contact Edmond Chow (echow@illinois.edu)

Holonyak Micro & Nanotechnology Lab

  • Twitter
  • Instagram
  • Facebook
  • LinkedIn
  • YouTube

208 North Wright Street

Urbana, IL 61801

Phone: 217-333-3097

Fax:

Email: mntl@illinois.edu

The Grainger College of Engineering

Get in touch

Around Campus

  • Campus Map
  • University Admissions
  • Careers at Illinois
  • University News
  • Giving at Illinois
  • University Alumni
  • Athletics
  • University Library

Universitywide Resources

  • Emergency Services
  • University Calendars
  • University Directory
  • Student Assistance Center
  • Health and Wellness
  • Parents and Families
  • University COVID-19 Information

About Illinois

  • VC of Diversity, Equity and Inclusion
  • Land Acknowledgement
  • University Research and Innovation
  • Technology Services
  • Illinois International
  • University Strategic Plan
  • University of Illinois System
  • Privacy Policy
  • Copyright © 2025
  • Accessibility
  • Webmaster
  • Login