Wire Bonding HB16

The HB16 is a versatile, semi-automatic bench-top wire bonder perfect for labs and small-scale production. It handles various wire materials like gold, aluminum, silver, and copper, in sizes ranging from 17µm to 75µm (with our lab primarily using 25µm). The machine features a 6.5" TFT touchscreen that provides an intuitive interface for controlling all bonding parameters and processes. A key feature is its single-head design that eliminates the need to change the bond head for different applications; you can simply switch tool tips for various bonding modes, including ball, wedge, and ribbon bonding. The HMNTL currently utilizes all three modes with gold wire. Its automated Z-axis sensor simplifies setup by automatically adjusting the bond height, while the simple loop programming feature allows you to create custom wire loop profiles up to 10 steps.