Oxford Freon RIE
The Oxford Freon RIE is a general purpose etch tool available for a wide variety of materials. The tool is not load-locked and is currently configured to etch small samples through 100mm wafers. . It is capable of processing at temperatures from 0°C up to 50°C. Etch gases are CHF3, SF6, CF4, Ar, N2 and O2.