Finetech Flip Chip Bonder

The Finetech sigma fineplacer is a flip chip bonder that can use heat, pressure, epoxy/solder paste, and ultrasonic vibrations to bond samples together. The tool reports 0.5 micron accuracy, up to 400C, up to 1000N of force, and compatibility with most liquid epoxy/solder paste. Samples less than 2cmx2cm can be placed onto substrates that fit on a 2"x2" square. Alignment will be determined by the horizontal alignment markers due to the camera only being able to see ~2.7mm vertically and can move horizontally as much as needed.