EVG 620 Double-Sided Mask Aligners
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The EVG 620 is a semi-automatic contact/proximity photolithography 365 nm mask aligner capable of one-micron front-side and two-micron back-side alignment accuracy. The aligner is currently configured with a 5-inch mask plate holder for aligning 4-inch wafers. It can be modified up to 7-inch mask plate holder for 150 mm wafers and down to a 4-inch mask plate holder for 3-inch wafers. Smaller samples can also be aligned.
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