EVG 301 Megasonic Cleaner and IR Inspector
| The EVG 301 is a tool that can clean wafers using 1 MHz modulated DI water to create transient cavities that remove debris while minimizing damage to the surface. The size of samples can range from 2” to 8” wafers. Another functionality of the EVG 301 is to image silicon-based bonds using an IR source and camera. The camera will be able to image voids in between the wafers. Installed Fall 2024. |