COMING SPRING 2025 - SUSS SB8Gen2 Bonder

The Suss wafer bonder can mechanically press 2 wafers together with varying temperature (20-500C, <1% error, +/-2% uniformity), chamber pressure (5x10^-5 mbar to 1 bar), and bond force (up to 20 kN). These variables are used to bond wafers together with adhesives (e.g. epoxies and polyimides), metals, and dielectrics.